ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis

The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.

• | Author: ASM International
• | Publisher: A S M International
• | Publication Date: Jul 30, 2022
• | Number of Pages:
• | Language:
• | Binding: Paperback / softback
• | ISBN-13: 9781627084192
• | ISBN-10: 1627084193