Overview
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
- | Author: ASM International
- | Publisher: A S M International
- | Publication Date: Jul 30, 2022
- | Number of Pages:
- | Language:
- | Binding: Paperback / softback
- | ISBN-13: 9781627084192
- | ISBN-10: 1627084193