Electromigration in Metals : Fundamentals to Nano-Interconnects

Learn to assess electromigration reliability, and design more resilient chips, from this comprehensive resource. Building from fundamental physics to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. This is an ideal text for materials scientists and chip design engineers.

• | : Paul S. Ho (University of Texas, Austin), Chao-Kun Hu, Martin Gall, Valeriy Sukharev
• | Publisher: Cambridge University Press
• | Publication Date: May 12, 2022
• | Country of Publication: United Kingdom
• | Number of Pages: 430 pages
• | Language: Unknown
• | Binding: Hardback
• | ISBN-10: 1107032385
• | ISBN-13: 9781107032385