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Thermal Management Materials for Electronic Packaging - Preparation, Characterization, and Devices
Wiley-VCH Verlag GmbH
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Wiley-VCH Verlag GmbH
Thermal Management Materials for Electronic Packaging - Preparation, Characterization, and Devices
- | By (Author): X Tian (Author)
- | Publisher: Wiley-VCH Verlag GmbH
- | Publication Date: Aug 07, 2024
- | Country of Publication: Germany
- | Number of Pages: 550 pages
- | Language: NULL
- | Binding: Hardback
- | ISBN-10: 3527352422
- | ISBN-13: 9783527352425
- By (Author):
- X Tian (Author)
- Publisher:
- Wiley-VCH Verlag GmbH
- Publication Date:
- Aug 07, 2024
- Country of Publication:
- Germany
- Language:
- NULL
- Number of pages:
- 550 pages
- Binding:
- Hardback
- ISBN-10:
- 3527352422
- ISBN-13:
- 9783527352425