Capacitively Coupled Chip-To-Chip Interconnect Design

Capacitively Coupled Chip-To-Chip Interconnect Design

VDM Verlag

SKU:

9783639253368

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UPC:

9783639253368

$61.74

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Capacitively Coupled Chip-To-Chip Interconnect Design

| By (Author): Lei Luo
| Publisher: VDM Verlag
| Publication Date: May 06, 2010
| Country of Publication: Germany
| Number of Pages: 140 pages
| Language: Unknown
| Binding: Paperback|Softback
| ISBN-10: 3639253361
| ISBN-13: 9783639253368

By (Author):: Lei Luo
Publisher:: VDM Verlag
Publication Date:: May 06, 2010
Country of Publication:: Germany
Language:: Unknown
Number of pages:: 140 pages
Binding:: Paperback|Softback
ISBN-10:: 3639253361
ISBN-13:: 9783639253368